How to Apply Thermal Compound on a Chip

The central processing unit, or CPU, in your computer performs the millions of calculations required to give you a smooth computing experience. That work generates over 100 watts of heat under maximum load, which means you need an efficient way to cool your computer. Modern CPUs dissipate heat by conducting it away from the processor via a metal contact plate. However, that contact is scratched and irregular at the microscopic level. Correctly applying thermal compound fills in the microscopic gaps, improving heat conduction and keeping your CPU cool.

Cleaning Your CPU

• 1

  Unplug your computer and open its case. The CPU will be underneath a large metal heat sink and attached to the largest circuit board, known as the "motherboard."

• 2

  Remove the heat sink from the motherboard to expose the CPU. For specific instructions, please consult your computer's owner's manual. Removing parts will be different for every make and model of computer.

• 3

  Add some isopropyl alcohol to the lint-free cloth and swab both the heat sink's and the CPU's metal contacts. Clean until no residue from the earlier thermal material remains.

Applying Thermal Compound

• 1

  Apply a thin vertical line of thermal compound to the center of the chip, with length of about two-thirds of the contact area.

• 2

  Place the heat sink directly on the CPU, making sure that it is oriented in the correct direction. Using gentle pressure, press the heat sink down until you feel resistance. Twist the heat sink slightly clockwise, then counter-clockwise to ensure the compound spreads evenly.

• 3

  Finish mounting the heat sink to the motherboard according to manufacturer instructions.