How to Remove Wii Chip Resin

If you want to apply a mod chip to your Nintendo Wii, once you dissemble the console you will find a thick black resin covering the area you need to access. This resin is epoxy glue and it covers the necessary chips you need to remove and replace. Getting rid of this resin is actually easier than it would seem once you have the necessary tools. However, you must be extremely careful as you may damage the circuits and motherboard.

• 1

  Turn on the hot air gun and allow it to heat up.

• 2

  Blow the hot air on the chip resin until it reaches a temperature of about 100 to 120 degrees Celsius or 212 to 248 degrees Fahrenheit.

• 3

  Pick off the resin slowly and very carefully with the scalpel. Do not attempt to pick it all off at once.

• 4

  Reheat the resin once it starts to get hard.

• 5

  Continue picking off the resin and reheating as necessary.